IDISIL for electronics industry

IDISIL® IMPROVES MECHANICAL STRENGTH OF PRINTED CIRCUIT BOARDS (PCBS)


Evonik's Colloidal Silica nanoparticles enhance the laminate of Printed Circuit Boards. The nanoparticles act as a resin modifier to improve mechanical strength, thermal stability and dielectric properties. IDISIL® particles have a very narrow particle size distribution and can be customized to your individual formulation.


The main substrate used to make PCBs is known as copper clad laminate (CCL).  IDISIL® Colloidal Silica particles can be used to enhance electrical and physical properties of CCL. With its ideal spherical shape it can be used as a resin modifier to improve the coefficient of thermal expansion. Also, IDISIL® can facilitate resin flow by acting as a spacer in between larger particles.

IDISIL® can be customized with a broad range of surface functional groups to suit your specific resin formulation to improve mechanical strength as well as dielectric properties.

Our IDISL® grades offer the following advantages in Printed Circuit Boards:

  • Very narrow particle size distribution, no fines or large particles

  • No volatile organic compounds (VOC)

  • Particle size ranges from few nm to µm 

  • Dried particles or particle dispersions in various solvents possible

  • High temperature resistance

  • Surface modification to achieve best performance

  • Easy particle dispersion in resin

LET'S WORK TOGETHER TO FIND THE BEST IDISL® GRADE FOR HIGHLY DEMANDING ELECTRONIC PRODUCTS!