IDISIL® IMPROVES MECHANICAL STRENGTH OF PRINTED CIRCUIT BOARDS (PCBS)
Evonik's Colloidal Silica nanoparticles enhance the laminate of Printed Circuit Boards. The nanoparticles act as a resin modifier to improve mechanical strength, thermal stability and dielectric properties. IDISIL® particles have a very narrow particle size distribution and can be customized to your individual formulation.
The main substrate used to make PCBs is known as copper clad laminate (CCL). IDISIL® Colloidal Silica particles can be used to enhance electrical and physical properties of CCL. With its ideal spherical shape it can be used as a resin modifier to improve the coefficient of thermal expansion. Also, IDISIL® can facilitate resin flow by acting as a spacer in between larger particles.
IDISIL® can be customized with a broad range of surface functional groups to suit your specific resin formulation to improve mechanical strength as well as dielectric properties.
Our IDISL® grades offer the following advantages in Printed Circuit Boards:
Very narrow particle size distribution, no fines or large particles
No volatile organic compounds (VOC)
Particle size ranges from few nm to µm
Dried particles or particle dispersions in various solvents possible
High temperature resistance
Surface modification to achieve best performance
Easy particle dispersion in resin