Chemical Mechanical Planarization
Chemical mechanical planarization (CMP) is an enabling technology in the fabrication of integrated circuits. Evonik is dedicated to be the preferred global partner for developing innovative solutions for CMP. Whether your objective is to improve process yield and efficiency in an existing CMP application, Evonik has the capabilities and experience necessary to satisfy the stringent requirements of semiconductor industry.
With the AEROSIL® and AEROXIDE® products Evonik is offering a broad range of Fumed Silica grades tailored to semiconductor applications. Now Evonik also offers IDISIL® ultra-high purity Colloidal Silica to serve the industry. Colloidal Silica as abrasive offers advantages for CMP - the process of polishing and planarizing dielectrics.
Chemical mechanical planarization (CMP) is an enabling technology in the fabrication of integrated circuits. The abrasive materials are the key component in a CMP slurry. The choice of slurry influences integration, manufacturing, reliability and yield in the CMP process. Slurries are increasingly tailored to their specific process applications and the tools being used.
Colloidal Silica as abrasive is being dispersed in water with other reagents and is one of the core formulation ingredients. Depending on their surface charge, surface functionalization and shape IDISIL® can show mechanical as well as chemical abrasive properties. If special surface functionalization is needed we can co-develop to create suitable particles according to your needs.
Our IDISL® grades offer the following advantages for CMP:
Ultra-high purity (metals in ppb range)
High batch to batch consistency
Monodispersity and uniformity of particle sizes
Discrete particles leading to low defectivity